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FlexTRAK-WR Plasma Treatment System




Features

The FlexTRAK-WR system is designed for high-throughput
processing of semiconductor wafers up to 300mm (12 in.).
The patented plasma chamber design provides exceptional
etch uniformity and process repeatability. Its three-axis
symmetrical chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results.

The universal architecture of the FlexTRAK-WR system
accommodates a wide range of wafer sizes in the same systems, yielding unmatched production flexibility. Its small
chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.

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